Entreprise's news

Welcome to Meet Flip Chip COB at ISLE 9.2-D32

CedarwillbringflipchipCOBP0.7,P0.9,P1.1,P1.2,P1.5,P1.9,P2.5toISLEexhibition,flipchiphashigherbrightness,bettercontrast(>20000:1)andmorestablethannormalCOB.  Welcometomeetusat9.2-D32,Cedarwillshowyouaf

2019-03-03

Entreprise's news

Interview with Wang Ruiguang, general manager of Changchun Cedar Electronics Technology Co., Ltd

OnSeptember19-21,2018,thethree-dayShanghaiInternationalLEDExhibitionwasheldinShanghaiPudongNewInternationalExpoCenter.Astheworld'searliestprofessionalbusinessprocurementplatformdedicatedtothedisplayofacompleteLEDindustrialchain.ShanghaiInternationalLEDExhibitionisknownasthe"vane"oftheindustry.TheLEDscreencompaniesareallcarryingthelatestproductstoshowoffattheexhibition,presentingvisitorswithasplendidvisualfeast.ChangchunCedarElectronicsTechnologyCo.,Ltd(hereinafterreferredtoas"CedarElectronics")asawell-knownmanufacturerofLEDdisplayindustry,hasintroducedCOBdisplayscreensince2014.ShowusthelatestproductsofMiniCOBseries.Intheindustry"MiniLED"isbecomingmorepopular,CedarElectronicsMiniCOBisparticularlyoutstanding,drewtheattentionofmanyprofessionalvisitorsintheindustry,receivedconsistentpraise.InordertounderstandMiniCOBdisplayproductsindetail,aspecialinterviewwasconductedbyLEDScreenWorldreportertoCedarElectronicsGeneralManagerWangRuiguang.AccordingtointroductionofWangRuiguang,CedarElectronicsisthefirstonedevelopedthe"integratedthree-in-one(COB)LEDdisplay"productintheindustry.Sinceitslaunchin2014,CedarCOBencapsulationtechnologyhasbeenverymature,andtheproductshavebeenwidelyacceptedbycustomers.WhencomparedwiththeSMDtypeLEDdisplay,theCOBpackageistofixtheLEDchipdirectlybondonthePCBboardwithconductiveadhesiveandinsulatingpaste,thentesttheconductivityoftheLEDchip.Afterthetestiscomplete,theLEDchipisencapsulatedwithepoxyresinadhesive.Inmanufacturingtechnologyandtechnologicalprocess,COBencapsulationnoneedsupportingframeandreflowweldingprocess,soitismorereliable.Whetherreliabilityorcost,COBdisplayisbetterthantheSMDdisplay.Today,theLEDdisplayofCedarElectronicshasbeenwidelyusedinsurveillanceandcommand,media,videoconferencing,transportation,education,medicaltreatmentandotherindustries.AlotprojectsofCOBLEDdisplayhavebeencompletedindomesticandinternationalmarket,suchastheNationalGrandTheater,theShanghaiBund,etc.CCTV,Beijing-ShiJiazhuanghigh-speedrailwaystationandothermajorprojects,productalsoexporttotheUnitedStates,Europe,Japan,Russiaandothercountriesandregions.CedarElectronicsCOBdisplayproductsonbehalfofourCountrytoparticipateininternationalinnovationexhibitionmanytimes.AlthoughCedarElectronics'COBdisplayproductsarewidelyusedindomesticandinternationalmarket,themarketshareofCOBdisplayisstillhardtocompetewiththatofSMDdisplayinthewholeLEDdisplayindustry.However,withthedevelopmentoffinepixelpitchLEDdisplaytechnology,LEDdisplayproductsusingSMDpackagingtechnologyarefacingthetechnicalandcostproblems.Aspixelpitchisgoingsmaller,thetechnicalrequirementsofenterprisesarebecominghigherandhigher,andthecostisincreasingatgeometriclevel.Inparticular,withtheminiaturizationoftheLEDpackage,theprotectiontreatmentproblemoftraditionalLEDdisplayisbecomingmoreandmoreobvious.Rightunderthiscircumstance,theCOBdisplaybeginspopularanddrawmoreattentionintheindustry.Intermsofprotection,"theCOBdisplayhasbetterprotectioninwaterproof,dust-proof,moisture-proof,anti-staticthantheSMD,"WangRuiguangsaid.Asfortheimplementationoffinepixelpitch,thisistheadvantageoftheCOBdisplay.InthetrendoffinepixelpitchtoMini/MicroLEDdevelopment,finepixelpitchseemstousheredinamoredifficultsituation.InordertosolveaseriesofproblemsencounteredinSMDfinepixelpitchdisplay,"MiniLED"with"fourinone"integratedpackagewasdeveloped.However,the"MiniLED"with"fourinone"integrationencapsulationcansolvesomeoftheproblemsencounteredinthefinepixelpitch,itisstillinsidethecategoryof"SMD",anditdoesnotsolvetheproblemthroughly.However,the"MiniCOB"withflipchipstructurechipisdifferent,ItcannotonlysolvetheproblemwhenusingSMDtechnologytomanufacturerthefinepixelpitchdisplay,butalsomakethepixelpitchsmaller.ThisShanghaiexhibition,CedarlaunchedflipchipCOBdisplayproducts,pixelpitchhasbeenaslowas0.9mm.AccordingtoWangRuiguang,CedarElectronicshasbeenabletomassproductionofpixelpitch0.7mm.Currently,pixelpitch0.5mmproductsarealsointheR&DPhase.AstheassessmentofCOBdisplayproducts,WangRuiguangsaidthatCOBdisplayproductsarenotonlyencapsulationtechnology,butalsorelyondrivingIC,systemcontrolandsystematizationtechnologyasthesupport.Intermsofthereliabilitywhichisindustry'smostconcernedissue,COBLEDdisplaypackagingofCedarElectronicsisoneorderofmagnitudehigherthanSMDdisplay,andtheMiniCOBdisplay,whichuseCedar’slatestflipchiptechnology,isanorderofmagnitudehigherthanthepreviousgenerationCOBdisplay.TheMiniCOBdisplayproductofCedarElectronicsshowatthisexhibitionshowthatalreadysolvethepainpointofthefinepixelpitchLEDdisplay.AsearlyasJulythisyear,CedarElectronicswonthe2017-2018ChinaLEDinnovationtechnologyandproductsawardinChinaOptoelectronicsIndustryAssociation,ChinaSemiconductorLighting/LEDIndustryandapplicationsAlliance,Chinaopticaloptoelectronicsindustryassociationlightemittingdiodedisplayapplicationbranch,optoelectronicindustryassociationofchinaoptoelectronicindustryassociationoptoelectronicdevicebranchandChinaelectronicnewspaperheldthe8thannual"ChinaLEDindustry(2017-2018)"The"selection"campaignwiththeleadingLEDflipchipCOBfinepixelpitchdisplayt

2019-02-04